Singapore POST

China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park

Issue date 01 Mar 2004

Overview

On 26 February 1994, the Agreement on the Joint Development of Suzhou Industrial Park (SIP) was signed by Chinese Vice Premier Li Lanqing and Singapore Senior Minister Lee Kuan Yew in Beijing. It marked the birth of the joint development of Suzhou Industrial Park between the two governments.

The vision for SIP is to build an integrated, modern, garden-like hi-tech township of international standards. SIP will have its own commercial, residential and social amenities to complement the industrial development.

The development of SIP began in May 1994. Since then, it has progressed from strength to strength. With the support of both governments, SIP has achieved a rapid growth of about 50% per year.

Industrial development is the foundation of SIP's development. It has since attracted more than 1320 Foreign Invested Enterprises with total investment exceeding US $\$200$ billions. SIP enjoys the highest average investment per project in China and has become one of the fastest growing and most competitive industrial parks in China.

This joint stamp issue is specially released to commemorate the 10th Anniversary of SIP and to record this significant and successful joint project between the governments of China and Singapore.

China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park
China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park
China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park
China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park
Technical specifications
Denomination60¢
Stamp Size40mm x 30mm
Collector’s Sheet Size236mm x 146mm
Perforation13.0
Paperunwatermarked
PrintingOffset Lithography
Sheet Content10 stamps per sheet
PrinterBeijing Stamp Printing House
Graphic DesignerZhang Lei
Singapore POST
Singapore POST
Singapore POST
Singapore POST

China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park

Issue date 01 Mar 2004

On 26 February 1994, the Agreement on the Joint Development of Suzhou Industrial Park (SIP) was signed by Chinese Vice Premier Li Lanqing and Singapore Senior Minister Lee Kuan Yew in Beijing. It marked the birth of the joint development of Suzhou Industrial Park between the two governments.

The vision for SIP is to build an integrated, modern, garden-like hi-tech township of international standards. SIP will have its own commercial, residential and social amenities to complement the industrial development.

The development of SIP began in May 1994. Since then, it has progressed from strength to strength. With the support of both governments, SIP has achieved a rapid growth of about 50% per year.

Industrial development is the foundation of SIP's development. It has since attracted more than 1320 Foreign Invested Enterprises with total investment exceeding US $\$200$ billions. SIP enjoys the highest average investment per project in China and has become one of the fastest growing and most competitive industrial parks in China.

This joint stamp issue is specially released to commemorate the 10th Anniversary of SIP and to record this significant and successful joint project between the governments of China and Singapore.

Denomination

60¢

Stamp Size

40mm x 30mm

Collector’s Sheet Size

236mm x 146mm

Perforation

13.0

Paper

unwatermarked

Printing

Offset Lithography

Sheet Content

10 stamps per sheet

Printer

Beijing Stamp Printing House

Graphic Designer

Zhang Lei

China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park

Issue date 01 Mar 2004

China-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial ParkChina-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial ParkChina-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial ParkChina-Singapore Joint Cooperation on the 10th Anniversary of Suzhou Industrial Park

Overview

On 26 February 1994, the Agreement on the Joint Development of Suzhou Industrial Park (SIP) was signed by Chinese Vice Premier Li Lanqing and Singapore Senior Minister Lee Kuan Yew in Beijing. It marked the birth of the joint development of Suzhou Industrial Park between the two governments.

The vision for SIP is to build an integrated, modern, garden-like hi-tech township of international standards. SIP will have its own commercial, residential and social amenities to complement the industrial development.

The development of SIP began in May 1994. Since then, it has progressed from strength to strength. With the support of both governments, SIP has achieved a rapid growth of about 50% per year.

Industrial development is the foundation of SIP's development. It has since attracted more than 1320 Foreign Invested Enterprises with total investment exceeding US $\$200$ billions. SIP enjoys the highest average investment per project in China and has become one of the fastest growing and most competitive industrial parks in China.

This joint stamp issue is specially released to commemorate the 10th Anniversary of SIP and to record this significant and successful joint project between the governments of China and Singapore.

Technical specifications

Denomination60¢
Stamp Size40mm x 30mm
Collector’s Sheet Size236mm x 146mm
Perforation13.0
Paperunwatermarked
PrintingOffset Lithography
Sheet Content10 stamps per sheet
PrinterBeijing Stamp Printing House
Graphic DesignerZhang Lei
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